"Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for ..."

Chaoqi Zhang et al. (2014)

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DOI: 10.1109/3DIC.2014.7152166

access: closed

type: Conference or Workshop Paper

metadata version: 2021-11-16

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Chaoqi Zhang, Paragkumar Thadesar, Muneeb Zia, Thomas E. Sarvey, Muhannad S. Bakir:
Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. 3DIC 2014: 1-4

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