"Collective and Gang Bonding for Three-Dimensional Integrated Circuits in ..."

Hiroto Tanaka et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058909

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

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Hiroto Tanaka, Yoshiyuki Arai, Toshiyuki Jinda, Noboru Asahi, Katsumi Terada:
Collective and Gang Bonding for Three-Dimensional Integrated Circuits in Chip-on-Wafer Process. 3DIC 2019: 1-3

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