"High Density and Low-Temperature Interconnection Enabled by Mechanical ..."

Sreejith Kochupurackal Rajan et al. (2019)

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DOI: 10.1109/3DIC48104.2019.9058840

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

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Sreejith Kochupurackal Rajan, Ming Jui Li, Muhannad S. Bakir, Gary S. May:
High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating. 3DIC 2019: 1-4

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