"Fault isolation of short defect in through silicon via (TSV) based 3D-IC."

Daniel H. Jung et al. (2013)

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DOI: 10.1109/3DIC.2013.6702376

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC 2013: 1-4

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