"300mm wafer thinning and backside passivation compatibility with temporary ..."

Anne Jourdain et al. (2010)

> Home

Details and statistics

DOI: 10.1109/3DIC.2010.5751468

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/JourdainBPPWSBBTS10
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/JourdainBPPWSBBTS10
Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen:
300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications. 3DIC 2010: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.