"Analysis of microbump induced stress effects in 3D stacked IC technologies."

Andrej Ivankovic et al. (2011)

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DOI: 10.1109/3DIC.2012.6262972

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-19

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Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte:
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC 2011: 1-5

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