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ORCIDMikael Detalle
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2010 – 2019
- 2016
[c9]C. Roda Neve, Mikael Detalle, Philip Nolmans, Yunlong Li, Joeri De Vos, Geert Van der Plas, Gerald Beyer, Eric Beyne
:
High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer. 3DIC 2016: 1-4- 2015
- [c8]Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen, Geert Van der Plas, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne:
Processing active devices on Si interposer and impact on cost. 3DIC 2015: TS11.2.1-TS11.2.4 - [c7]Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, Stefaan Van Huylenbroeck, Shih-Hung Chen, Erik Jan Marinissen, Antonio La Manna, Geert Van der Plas, Dimitri Linten, Eric Beyne, Aaron Thean:
Active-lite interposer for 2.5 & 3D integration. VLSIC 2015: 222- - 2014
- [c6]X. Sun, Geert Van der Plas, Mikael Detalle, Eric Beyne:
Analysis of 3D interconnect performance: Effect of the Si substrate resistivity. 3DIC 2014: 1-4 - [c5]Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas, Eric Beyne:
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges. 3DIC 2014: 1-7 - 2013
- [c4]Dimitrios Velenis, Mikael Detalle, Erik Jan Marinissen, Eric Beyne:
Si interposer build-up options and impact on 3D system cost. 3DIC 2013: 1-5 - 2012
- [c3]Jaemin Kim, Sunyoung Kim, Julien Ryckaert, Mikael Detalle, Nele Van Hoovels, Pol Marchal:
A calibrated pathfinding model for signal integrity analysis on interposer. CICC 2012: 1-4 - 2011
- [c2]Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte:
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC 2011: 1-5 - [c1]Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, Wenqi Zhang, Eric Beyne:
3D stacking using ultra thin dies. 3DIC 2011: 1-5
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