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"Die to wafer 3D stacking for below 10um pitch microbumps."
Jaber Derakhshandeh et al. (2016)
- Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey
, Geraldine Jamieson, Fumihiro Inoue
, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne
, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller:
Die to wafer 3D stacking for below 10um pitch microbumps. 3DIC 2016: 1-4
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