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Jean-Claude Lecomte

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Journal Articles

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2009
[j2]
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  - journals/mr/HertlWL09
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  - https://dblp.org/rec/journals/mr/HertlWL09
Michael Hertl, Diane Weidmann, Jean-Claude Lecomte:
An advanced quality and reliability assessment approach applied to thermal stress issues in electronic components and assemblies. Microelectron. Reliab. 49(9-11): 1148-1152 (2009)
2005
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Isaline Richard, Romain Fayolle, Jean-Claude Lecomte:
New experimental approach for failure prediction in electronics: Topography and deformation measurement complemented with acoustic microscopy. Microelectron. Reliab. 45(9-11): 1645-1651 (2005)

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