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ORCIDRohit Dhiman
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2020 – today
- 2023
[j6]Ajay Kumar
, Rohit Dhiman:
Frequency response and transient analysis of through glass packaging vias using matrix-rational approximation (MRA) technique for three-dimensional ICs. Microelectron. J. 141: 105941 (2023)- 2022
- [j5]Ajay Kumar, Rajeevan Chandel, Rohit Dhiman:
Proposal and analysis of carbon nanotube based differential multibit through glass vias. Microelectron. J. 126: 105500 (2022) - [j4]Anchal Thakur, Rohit Dhiman:
A physics-based drain current model for Si1-xGex source/drain NT JLFET for enhanced hot carrier reliability with temperature measurement. Microelectron. J. 126: 105501 (2022) - [c7]Ajay Kumar, Rohit Dhiman:
Differential Multi-bit Through Glass Vias for Three-Dimensional Integrated Circuits. VDAT 2022: 12-26 - 2021
- [j3]Ashish Singh, Rajeevan Chandel, Rohit Dhiman:
Proposal and analysis of relative stability in mixed CNT bundle for sub-threshold interconnects. Integr. 80: 29-40 (2021) - [c6]Palak Sood, Rohit Dhiman:
Brain-Computer Interfacing: Design of Virtual Keyboard. ICCCNT 2021: 1-6
2010 – 2019
- 2019
- [c5]Anchal Thakur, Rohit Dhiman:
Design and Performance Analysis of SiGe Hetero Nanotube Junctionless FET. TENCON 2019: 2424-2427 - 2017
- [c4]Manish Joshi, Koduri Teja, Ashish Singh, Rohit Dhiman:
Delay and Frequency Investigations in Coupled MLGNR Interconnects. VDAT 2017: 429-440 - 2016
- [c3]Ramesh Kumar, Rohit Dhiman, Rajeevan Chandel:
Performance Analysis of Top-Contact MLGNR Based Interconnects. iNIS 2016: 11-16 - [c2]Abhishek Shrivastava, Ajay Pratap Gangwar, Rahul Kumar, Rohit Dhiman:
A 60 dB Bulk-Driven Rail-to-Rail Input/Output OTA. iNIS 2016: 139-143 - 2015
- [j2]Rohit Dhiman, Rajeevan Chandel:
Dynamic Crosstalk Analysis in Coupled Interconnects for Ultra-Low Power Applications. Circuits Syst. Signal Process. 34(1): 21-40 (2015) - 2012
- [j1]Rohit Dhiman, Rajeevan Chandel:
Sub-Threshold Delay and Power Analysis of Complementary Metal-Oxide Semiconductor Buffer Driven Interconnect Load for Ultra Low Power Applications. J. Low Power Electron. 8(1): 39-46 (2012) - 2011
- [c1]Tafseer Alam, Rohit Dhiman, Rajeevan Chandel:
Resistive analysis of mixed carbon nanotube bundle interconnect and its comparison with copper interconnect. ICWET 2011: 1157-1160
Coauthor Index
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