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Thomas Signamarcheix

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2020 – today

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2021
[c9]
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  - conf/esscirc/LequepeysDBCFEH21
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Jean-René Léquepeys, Marc Duranton, Susana Bonnetier, Sandrine Catrou, Richard Fournel, Thomas Ernst, Laurent Hérault, D. Louis, A. Jerraya, Alexandre Valentian, François Perruchot, Thomas Signamarcheix, Elisa Vianello, Carlo Reita:
Overcoming the Data Deluge Challenges with Greener Electronics. ESSCIRC 2021: 7-14
[c8]
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Jean-René Léquepeys, Marc Duranton, Susana Bonnetier, Sandrine Catrou, Richard Fournel, Thomas Ernst, Laurent Hérault, D. Louis, A. Jerraya, Alexandre Valentian, François Perruchot, Thomas Signamarcheix, Elisa Vianello, Carlo Reita:
Overcoming the Data Deluge Challenges with Greener Electronics. ESSDERC 2021: 7-14

2010 – 2019

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2014
[c7]
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  - conf/3dic/BeilliardMCCRNA14
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Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix:
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO₂ direct hybrid bonding. 3DIC 2014: 1-8
2013
[c6]
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Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry:
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC 2013: 1-7
[c5]
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Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu:
Novel low temperature 3D wafer stacking technology for high density device integration. ESSDERC 2013: 151-154
2012
[j1]
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Akiko Ohata, Young-Ho Bae, Sorin Cristoloveanu, Thomas Signamarcheix, J. Widiez, Bruno Ghyselen, Olivier Faynot, Laurent Clavelier:
Deep-amorphization and solid-phase epitaxial regrowth processes for hybrid orientation technologies in SOI MOSFETs with thin body. Microelectron. Reliab. 52(11): 2602-2608 (2012)
2011
[c4]
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Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix:
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC 2011: 1-4
2010
[c3]
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Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka:
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC 2010: 1-6

2000 – 2009

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2009
[c2]
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Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier:
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. 3DIC 2009: 1-4
[c1]
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  - conf/3dic/LeducACZSRRVBBCFS09
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Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon:
First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC 2009: 1-5

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