"First integration of Cu TSV using die-to-wafer direct bonding and ..."

Patrick Leduc et al. (2009)

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DOI: 10.1109/3DIC.2009.5306602

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  - https://dblp.org/rec/conf/3dic/LeducACZSRRVBBCFS09
Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon:
First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC 2009: 1-5

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