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ORCIDBo Dai 0018
Person information
- affiliation: State Key Laboratory of Mobile Network and Mobile Multimedia Technology, Shenzhen, China
- affiliation: ZTE Corporation, Wireless Research Institute, Beijing, China
Other persons with the same name
- Bo Dai 0001 — Google Brain, USA (and 2 more)
- Bo Dai 0002
![[0000-0003-0777-9232]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0003-0777-9232")
— Shanghai AI Laboratory, China (and 2 more) - Bo Dai 0003 — University of Technology of Troyes, Charles Delaunay Institute, France
- Bo Dai 0004 — Chinese Academy of Sciences, Shenyang Institute of Automation, China
- Bo Dai 0005 — University of Shanghai for Science and Technology, MOE Engineering Research Center of Optical Instrument and System, China (and 1 more)
- Bo Dai 0006 — University of Electronic Science and Technology, School of Computer Science and Engineering, Chengdu, China
- Bo Dai 0007 — State Grid Zhejiang Electric Power Corporation Information and Telecommunication Branch, China
- Bo Dai 0008 — Hohai University, College of Water Conservancy and Hydropower Engineering, Nanjing, China
- Bo Dai 0009 — Beijing Institute of Petrochemical Technology, College of Information Engineering, China
- Bo Dai 0010 — Northeastern University, College of Information Science & Engineering, Shenyang, China (and 1 more)
- Bo Dai 0011 — Beijing University of Posts and Telecommunications, School of Economics, China
- Bo Dai 0012 — China Galaxy Securities Co. Ltd., Chengdu, China
- Bo Dai 0013 — Purdue University, Department of Computer Science, West Lafayette, IN, USA
- Bo Dai 0014 — Xidian University, State Key Laboratory of Integrated Services Networks, Xi'an, China
- Bo Dai 0015 — Beihang University, School of Instrumentation Science and Opto-electronics Engineering, Beijing, China
- Bo Dai 0016 — Southeast University, School of Instrument Science and Engineering, Nanjing, China
- Bo Dai 0017 — Tsinghua University, Beijing, China (and 2 more)
- Bo Dai 0019 — Beijing Jiaotong University, School of Mechanical and Electronic Engineering, China
- Bo Dai 0020 — Hunan University of Technology and Business, School of Management, Changsha, China
- Bo Dai 0021 — Chengdu University of Technology, China
- Bo Dai 0022 — Tiangong University, School of Electrical and Electronic Engineering, Tianjin, China
- Bo Dai 0023 — Southwest University of Science and Technology, State Key Laboratory for Environmental-Friendly Energy Materials, Mianyang, China
- Bo Dai 0024 — Guilin University of Electronic Technology, School of Electronic Engineering and Automation, Guangxi, China
- Bo Dai 0025 — Peking University, School of Intelligence Science and Technology, Beijing, China (and 1 more)
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2020 – today
- 2022
[c2]Jie Tan, Xiubin Sha, Ting Lu, Bo Dai:
A Short Survey on Future Research of AI and IoT Technologies. IWCMC 2022: 190-195- 2020
- [c1]Jie Tan, Xiubin Sha, Bo Dai, Ting Lu:
Wireless Technology and Protocol for Hot and Digital Twins. Kaleidoscope 2020: 1-8
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