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ORCIDChang-Lin Yeh
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2010 – 2019
- 2011
[j14]Hsiang-Chen Hsu
, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai:
Characteristic of copper wire and transient analysis on wirebonding process. Microelectron. Reliab. 51(1): 179-186 (2011)
2000 – 2009
- 2008
- [j13]Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh:
Effects of different drop test conditions on board-level reliability of chip-scale packages. Microelectron. Reliab. 48(2): 274-281 (2008) - [j12]Chang-Lin Yeh, Yi-Shao Lai:
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. Microelectron. Reliab. 48(2): 282-292 (2008) - [j11]Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen:
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. Microelectron. Reliab. 48(5): 757-762 (2008) - [j10]Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen:
Finite element model verification for packaged printed circuit board by experimental modal analysis. Microelectron. Reliab. 48(11-12): 1837-1846 (2008) - 2007
- [j9]Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen:
Empirical correlation between package-level ball impact test and board-level drop reliability. Microelectron. Reliab. 47(7): 1127-1134 (2007) - [j8]Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen:
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. Microelectron. Reliab. 47(8): 1239-1245 (2007) - [j7]Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh:
Evaluation of solder joint strengths under ball impact test. Microelectron. Reliab. 47(12): 2179-2187 (2007) - [j6]Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai:
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. Microelectron. Reliab. 47(12): 2188-2196 (2007) - 2006
- [j5]Chang-Lin Yeh, Yi-Shao Lai:
Support excitation scheme for transient analysis of JEDEC board-level drop test. Microelectron. Reliab. 46(2-4): 626-636 (2006) - [j4]Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh:
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectron. Reliab. 46(2-4): 645-650 (2006) - [j3]Chang-Lin Yeh, Yi-Shao Lai:
Transient fracturing of solder joints subjected to displacement-controlled impact loads. Microelectron. Reliab. 46(5-6): 885-895 (2006) - [j2]Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao:
Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectron. Reliab. 46(7): 1172-1182 (2006) - 2005
- [j1]Chang-Lin Yeh, Yi-Shao Lai:
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectron. Reliab. 45(2): 371-378 (2005)
Coauthor Index
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