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Tong An
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2020 – today
- 2023
- [j9]Jinxin Zuo, Ziyu Guo, Tong An, Zhongwei Xu, Yueming Lu:
A Security Resilience Metric Framework Based on the Evolution of Attack and Defense Scenarios. IEEE Internet Things J. 10(19): 17007-17021 (2023) - [j8]Tao Zhang, Tong An, Yanzhang Geng, Zhongzheng Liu, Xin Zhao, Shuang Li:
Dual-mode active noise control system with on-line identification of secondary path. Multim. Tools Appl. 82(22): 33889-33910 (2023) - 2022
- [c3]Xiaowei Chen, HeFang Jiang, Shaocheng Wu, Tao Liu, Tong An, Zhongwei Xu, Man Zhang, Muhammad Shafiq:
New Generation Power System Security Protection Technology Based on Dynamic Defense. ICAIS (3) 2022: 710-721 - 2021
- [j7]Lu Xing, Eric Lee, Tong An, Bo-Cheng Chu, Ahmed Mahmood, Ahmed M. Aly, Jianguo Wang, Walid G. Aref:
An Experimental Evaluation and Investigation of Waves of Misery in R-trees. Proc. VLDB Endow. 15(3): 478-490 (2021) - [j6]Tong An, Tao Zhang, Yanzhang Geng, Hai-Quan Jiao:
Normalized Combinations of Proportionate Affine Projection Sign Subband Adaptive Filter. Sci. Program. 2021: 8826868:1-8826868:12 (2021) - [c2]Zhongzheng Liu, Tao Zhang, Yanzhang Geng, Tong An:
Underwater Wireless High-Efficiency Energy Transmission Method Based on the Ultrasonic Transducer Array. ICCT 2021: 192-197 - [i1]Lu Xing, Eric Lee, Tong An, Bo-Cheng Chu, Ahmed Mahmood, Ahmed M. Aly, Jianguo Wang, Walid G. Aref:
An Experimental Evaluation and Investigation of Waves of Misery in R-trees. CoRR abs/2112.13174 (2021)
2010 – 2019
- 2018
- [j5]Si Chen, Zhizhe Wang, Yunfei En, Yun Huang, Fei Qin, Tong An:
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. Microelectron. Reliab. 91: 52-66 (2018) - [j4]Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen:
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Microelectron. Reliab. 91: 213-226 (2018) - 2016
- [j3]Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi:
Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectron. Reliab. 63: 183-193 (2016) - 2014
- [j2]Tong An, Fei Qin:
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates. Microelectron. Reliab. 54(5): 932-938 (2014) - 2011
- [j1]Tong An, Fei Qin, Jiangang Li:
Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectron. Reliab. 51(5): 1011-1019 (2011)
2000 – 2009
- 2005
- [c1]Deqiang Wang, Mingyang Pan, Tong An, Kelun Wang, Shuyan Qu:
Hamiltonian-like Properties of k-Ary n-Cubes. PDCAT 2005: 1002-1007
Coauthor Index
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