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Tong An
This is just a disambiguation page, and is not intended to be the bibliography of an actual person. Any publication listed on this page has not been assigned to an actual author yet. If you know the true author of one of the publications listed below, you are welcome to contact us.
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Journal Articles
- 2023
- [j9]Jinxin Zuo, Ziyu Guo, Tong An, Zhongwei Xu, Yueming Lu:
A Security Resilience Metric Framework Based on the Evolution of Attack and Defense Scenarios. IEEE Internet Things J. 10(19): 17007-17021 (2023) - [j8]Tao Zhang, Tong An, Yanzhang Geng, Zhongzheng Liu, Xin Zhao, Shuang Li:
Dual-mode active noise control system with on-line identification of secondary path. Multim. Tools Appl. 82(22): 33889-33910 (2023) - 2021
- [j7]Lu Xing, Eric Lee, Tong An, Bo-Cheng Chu, Ahmed Mahmood, Ahmed M. Aly, Jianguo Wang, Walid G. Aref:
An Experimental Evaluation and Investigation of Waves of Misery in R-trees. Proc. VLDB Endow. 15(3): 478-490 (2021) - [j6]Tong An, Tao Zhang, Yanzhang Geng, Hai-Quan Jiao:
Normalized Combinations of Proportionate Affine Projection Sign Subband Adaptive Filter. Sci. Program. 2021: 8826868:1-8826868:12 (2021) - 2018
- [j5]Si Chen, Zhizhe Wang, Yunfei En, Yun Huang, Fei Qin, Tong An:
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface. Microelectron. Reliab. 91: 52-66 (2018) - [j4]Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen:
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests. Microelectron. Reliab. 91: 213-226 (2018) - 2016
- [j3]Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi:
Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectron. Reliab. 63: 183-193 (2016) - 2014
- [j2]Tong An, Fei Qin:
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates. Microelectron. Reliab. 54(5): 932-938 (2014) - 2011
- [j1]Tong An, Fei Qin, Jiangang Li:
Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectron. Reliab. 51(5): 1011-1019 (2011)
Conference and Workshop Papers
- 2022
- [c3]Xiaowei Chen, HeFang Jiang, Shaocheng Wu, Tao Liu, Tong An, Zhongwei Xu, Man Zhang, Muhammad Shafiq:
New Generation Power System Security Protection Technology Based on Dynamic Defense. ICAIS (3) 2022: 710-721 - 2021
- [c2]Zhongzheng Liu, Tao Zhang, Yanzhang Geng, Tong An:
Underwater Wireless High-Efficiency Energy Transmission Method Based on the Ultrasonic Transducer Array. ICCT 2021: 192-197 - 2005
- [c1]Deqiang Wang, Mingyang Pan, Tong An, Kelun Wang, Shuyan Qu:
Hamiltonian-like Properties of k-Ary n-Cubes. PDCAT 2005: 1002-1007
Informal and Other Publications
- 2021
- [i1]Lu Xing, Eric Lee, Tong An, Bo-Cheng Chu, Ahmed Mahmood, Ahmed M. Aly, Jianguo Wang, Walid G. Aref:
An Experimental Evaluation and Investigation of Waves of Misery in R-trees. CoRR abs/2112.13174 (2021)
Coauthor Index
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