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2010 – 2019
- 2018
[j7]Byung-seung Yim, Young-Eui Shin, Jong-Min Kim:
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs). Microelectron. Reliab. 91: 201-212 (2018)- 2016
- [j6]Byung-seung Yim, Jong-Min Kim:
Thermo-mechanical reliability of a multi-walled carbon nanotube-incorporated solderable isotropic conductive adhesive. Microelectron. Reliab. 57: 93-100 (2016) - 2014
- [j5]Byung-seung Yim
, Jeong-Il Lee, Byung-Hun Lee, Young-Eui Shin, Jong-Min Kim:
An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler. Microelectron. Reliab. 54(12): 2944-2950 (2014) - 2012
- [j4]Jiwon Kim, Byung-seung Yim, Jongmin Kim, Jooheon Kim:
The effects of functionalized graphene nanosheets on the thermal and mechanical properties of epoxy composites for anisotropic conductive adhesives (ACAs). Microelectron. Reliab. 52(3): 595-602 (2012) - [j3]Byung-seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee, Jongmin Kim:
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging. Microelectron. Reliab. 52(6): 1165-1173 (2012) - 2011
- [j2]Yumi Kwon, Byung-seung Yim, Jongmin Kim, Jooheon Kim:
Dispersion, hybrid interconnection and heat dissipation properties of functionalized carbon nanotubes in epoxy composites for electrically conductive adhesives (ECAs). Microelectron. Reliab. 51(4): 812-818 (2011) - [j1]Yumi Kwon, Byung-seung Yim, Jongmin Kim, Jooheon Kim:
Mechanical and wetting properties of epoxy resins: Amine-containing epoxy-terminated siloxane oligomer with or without reductant. Microelectron. Reliab. 51(4): 819-825 (2011)
Coauthor Index
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