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Yong-Eui Shin

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2010 – 2019

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2012
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Byung-seung Yim, Yumi Kwon, Seung Hoon Oh, Jooheon Kim, Yong-Eui Shin, Seong Hyuk Lee, Jongmin Kim:
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging. Microelectron. Reliab. 52(6): 1165-1173 (2012)

2000 – 2009

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2004
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Jong-Min Kim, Yong-Eui Shin, Kozo Fujimoto:
Dynamic modeling for resin self-alignment mechanism. Microelectron. Reliab. 44(6): 983-992 (2004)

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