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Ish Chadha

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Conference and Workshop Papers

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2023
[c1]
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Ying Wei, Yi Chieh Huang, Haiming Tang, Nithya Sankaran, Ish Chadha, Dai Dai, Olakanmi Oluwole, Vishnu Balan, Edward Lee:
NVLink-C2C: A Coherent Off Package Chip-to-Chip Interconnect with 40Gbps/pin Single-ended Signaling. ISSCC 2023: 160-161

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