"NVLink-C2C: A Coherent Off Package Chip-to-Chip Interconnect with ..."

Ying Wei et al. (2023)

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DOI: 10.1109/ISSCC42615.2023.10067395

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-29

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Ying Wei, Yi Chieh Huang, Haiming Tang, Nithya Sankaran, Ish Chadha, Dai Dai, Olakanmi Oluwole, Vishnu Balan, Edward Lee:
NVLink-C2C: A Coherent Off Package Chip-to-Chip Interconnect with 40Gbps/pin Single-ended Signaling. ISSCC 2023: 160-161

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