default search action

combined dblp search
author search
venue search
publication search

ask others

Ming-Chih Yew

> Home > Persons

Person information

Refine list

refinements active!

zoomed in on ?? of ?? records

view refined list in

export refined list as

showing all ?? records

Journal Articles

see FAQ

What is the meaning of the colors in the publication lists?

2008
[j3]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/ChouHYYYC08
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/ChouHYYYC08
Chan-Yen Chou, Tuan-Yu Hung, Shin-Yueh Yang, Ming-Chih Yew, Wen-Kun Yang, Kuo-Ning Chiang:
Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. Microelectron. Reliab. 48(8-9): 1149-1154 (2008)
2007
[j2]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/YewCC07
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/YewCC07
Ming-Chih Yew, Chan-Yen Chou, Kuo-Ning Chiang:
Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis. Microelectron. Reliab. 47(9-11): 1658-1662 (2007)
2006
[j1]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/YewCHYC06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/YewCHYC06
Ming-Chih Yew, C. Y. Chou, C. S. Huang, W. K. Yang, Kuo-Ning Chiang:
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis. Microelectron. Reliab. 46(9-11): 1874-1879 (2006)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.