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Jan K. Spelt

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Journal Articles

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2012
[j6]
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  dblp key:
  - journals/mr/NadimpalliS12
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  - https://dblp.org/rec/journals/mr/NadimpalliS12
Siva P. V. Nadimpalli, Jan K. Spelt:
Prediction of pad cratering fracture at the copper pad - Printed circuit board interface. Microelectron. Reliab. 52(7): 1454-1463 (2012)
2008
[j5]
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  - journals/mr/BelashovS08
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O. Belashov, Jan K. Spelt:
Thermal stress concentration factors for defects in plated-through-vias. Microelectron. Reliab. 48(2): 225-244 (2008)
[j4]
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  - journals/mr/ShirleyGS08
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Dwayne R. Shirley, Hamid R. Ghorbani, Jan K. Spelt:
Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints. Microelectron. Reliab. 48(3): 455-470 (2008)
2007
[j3]
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  - journals/qre/LamS07
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Rex Lam, Jan K. Spelt:
Comparison of Weibull small samples using Monte Carlo simulations. Qual. Reliab. Eng. Int. 23(4): 503-513 (2007)
2006
[j2]
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  - journals/mr/QiLGSS06
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Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt:
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. Microelectron. Reliab. 46(2-4): 574-588 (2006)
[j1]
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  - journals/mr/GhorbaniS06
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Hamid R. Ghorbani, Jan K. Spelt:
Interfacial thermal stresses in solder joints of leadless chip resistors. Microelectron. Reliab. 46(5-6): 873-884 (2006)

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