"Effect of primary creep and plasticity in the modeling of thermal fatigue ..."

Dwayne R. Shirley, Hamid R. Ghorbani, Jan K. Spelt (2008)

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DOI: 10.1016/J.MICROREL.2007.08.002

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dwayne R. Shirley, Hamid R. Ghorbani, Jan K. Spelt:
Effect of primary creep and plasticity in the modeling of thermal fatigue of SnPb and SnAgCu solder joints. Microelectron. Reliab. 48(3): 455-470 (2008)

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