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Shunsuke Ikegaya

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2010 – 2019

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2015
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Hisashi Kino, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka:
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. 3DIC 2015: TS8.26.1-TS8.26.4

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