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"Consideration of microbump layout for reduction of local bending stress ..."
Hisashi Kino et al. (2015)
- Hisashi Kino
, Hideto Hashiguchi, Seiya Tanikawa, Yohei Sugawara, Shunsuke Ikegaya
, Takafumi Fukushima
, Mitsumasa Koyanagi, Tetsu Tanaka
:
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. 3DIC 2015: TS8.26.1-TS8.26.4
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