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Raj Sekar Sethu

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Journal Articles

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2016
[j2]
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  - journals/mr/HeinESWB16
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  - https://dblp.org/rec/journals/mr/HeinESWB16
Verena Hein, Marco Erstling, Raj Sekar Sethu, Kirsten Weide-Zaage, Tianlin Bai:
Reliability evaluation of tungsten donut-via as an element of the highly robust metallization. Microelectron. Reliab. 64: 259-265 (2016)
2015
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Raj Sekar Sethu, Hong Seng Ng, Alvin Chan, Cheng Nee Ong, Sieng Fong Chan:
Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure. Microelectron. Reliab. 55(7): 1101-1108 (2015)

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