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ORCIDLokesh Siddhu
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2020 – today
- 2024
[j6]Shailja Pandey
, Lokesh Siddhu, Preeti Ranjan Panda:
NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching. ACM Trans. Design Autom. Electr. Syst. 29(1): 19:1-19:35 (2024)- 2023
- [j5]Lokesh Siddhu, Hassan Nassar, Lars Bauer, Christian Hakert, Nils Hölscher, Jian-Jia Chen, Jörg Henkel:
Swift-CNN: Leveraging PCM Memory's Fast Write Mode to Accelerate CNNs. IEEE Embed. Syst. Lett. 15(4): 234-237 (2023) - [j4]Lokesh Siddhu, Aritra Bagchi, Rajesh Kedia, Isaar Ahmad, Shailja Pandey, Preeti Ranjan Panda:
Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure. ACM Trans. Embed. Comput. Syst. 22(6): 104:1-104:27 (2023) - [c4]Jörg Henkel, Lokesh Siddhu, Lars Bauer, Jürgen Teich, Stefan Wildermann, Mehdi B. Tahoori, Mahta Mayahinia, Jerónimo Castrillón, Asif Ali Khan, Hamid Farzaneh, João Paulo C. de Lima, Jian-Jia Chen, Christian Hakert, Kuan-Hsun Chen, Chia-Lin Yang, Hsiang-Yun Cheng:
Special Session - Non-Volatile Memories: Challenges and Opportunities for Embedded System Architectures with Focus on Machine Learning Applications. CASES 2023: 11-20 - 2022
- [j3]Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, Anuj Pathania, Jörg Henkel, Preeti Ranjan Panda:
CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems. ACM Trans. Archit. Code Optim. 19(3): 44:1-44:25 (2022) - [c3]Lokesh Siddhu, Rajesh Kedia, Preeti Ranjan Panda:
CoreMemDTM: Integrated Processor Core and 3D Memory Dynamic Thermal Management for Improved Performance. DATE 2022: 1377-1382 - 2021
- [j2]Lokesh Siddhu, Rajesh Kedia, Preeti Ranjan Panda:
Leakage-Aware Dynamic Thermal Management of 3D Memories. ACM Trans. Design Autom. Electr. Syst. 26(2): 12:1-12:31 (2021) - [i1]Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, Anuj Pathania, Jörg Henkel, Preeti Ranjan Panda:
CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems. CoRR abs/2109.12405 (2021)
2010 – 2019
- 2019
- [j1]Lokesh Siddhu, Preeti Ranjan Panda:
PredictNcool: Leakage Aware Thermal Management for 3D Memories Using a Lightweight Temperature Predictor. ACM Trans. Embed. Comput. Syst. 18(5s): 64:1-64:22 (2019) - [c2]Lokesh Siddhu, Preeti Ranjan Panda:
FastCool: Leakage Aware Dynamic Thermal Management of 3D Memories. DATE 2019: 272-275 - 2014
- [c1]Lokesh Siddhu, Amit Mishra, Virendra Singh:
Operand Isolation with Reduced Overhead for Low Power Datapath Design. VLSID 2014: 483-488
Coauthor Index
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