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Christopher Gregory

Chris W. Gregory

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Conference and Workshop Papers

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2013
[c3]
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  - conf/3dic/LueckGMHLT13
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  - https://dblp.org/rec/conf/3dic/LueckGMHLT13
Matthew Lueck, Chris W. Gregory, Dean Malta, Alan Huffman, John M. Lannon, Dorota Temple:
High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 μm pitch. 3DIC 2013: 1-5
2010
[c2]
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Dean Malta, Erik Vick, Scott H. Goodwin, Christopher Gregory, Matthew Lueck, Alan Huffman, Dorota Temple:
Fabrication of TSV-based silicon interposers. 3DIC 2010: 1-6
[c1]
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  - conf/3dic/ReedGGT10
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Jason D. Reed, Scott H. Goodwin, Christopher Gregory, Dorota Temple:
Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration. 3DIC 2010: 1-8

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