"Reliability testing of high aspect ratio through silicon vias fabricated ..."

Jason D. Reed et al. (2010)

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DOI: 10.1109/3DIC.2010.5751434

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type: Conference or Workshop Paper

metadata version: 2017-05-21

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Jason D. Reed, Scott H. Goodwin, Christopher Gregory, Dorota Temple:
Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration. 3DIC 2010: 1-8

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