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Peter Kjær Kristensen

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Journal Articles

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2018
[j5]
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  - https://dblp.org/rec/journals/mr/BrinckerKSEP18
Mads Brincker, Peter Kjær Kristensen, S. Söhl, R. Eisele, Vladimir N. Popok:
Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates. Microelectron. Reliab. 88-90: 774-778 (2018)
2016
[j4]
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Vladimir N. Popok, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Kjeld Pedersen:
Comprehensive physical analysis of bond wire interfaces in power modules. Microelectron. Reliab. 58: 58-64 (2016)
[j3]
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Mads Brincker, Peter Kjær Kristensen, Kristian Bonderup Pedersen, Vladimir N. Popok:
Mechanisms of metallization degradation in high power diodes. Microelectron. Reliab. 64: 489-493 (2016)
2015
[j2]
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Mads Brincker, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok:
Effects of thermal cycling on aluminum metallization of power diodes. Microelectron. Reliab. 55(9-10): 1988-1991 (2015)
2013
[j1]
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  - journals/mr/PedersenKPP13
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Kristian Bonderup Pedersen, Peter Kjær Kristensen, Vladimir N. Popok, Kjeld Pedersen:
Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules. Microelectron. Reliab. 53(9-11): 1422-1426 (2013)

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