"Comprehensive physical analysis of bond wire interfaces in power modules."

Vladimir N. Popok et al. (2016)

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DOI: 10.1016/J.MICROREL.2015.11.025

access: closed

type: Journal Article

metadata version: 2023-09-30

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Vladimir N. Popok, Kristian Bonderup Pedersen, Peter Kjær Kristensen, Kjeld Pedersen:
Comprehensive physical analysis of bond wire interfaces in power modules. Microelectron. Reliab. 58: 58-64 (2016)

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