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Klaus Schock

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Journal Articles

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2016
[j3]
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  - journals/mr/KleindiekSRZLMK16
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  - https://dblp.org/rec/journals/mr/KleindiekSRZLMK16
Stephan Kleindiek, Klaus Schock, Andreas Rummel, Michael Zschornack, Pascal Limbecker, Andreas Meyer, Matthias Kemmler:
Current imaging, EBIC/EBAC, and electrical probing combined for fast and reliable in situ electrical fault isolation. Microelectron. Reliab. 64: 313-316 (2016)
2013
[j2]
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Andreas Rummel, Klaus Schock, Matthias Kemmler, Andrew Smith, Stephan Kleindiek:
Repairing bonding wire connections using a microsoldering unit inside an SEM. Microelectron. Reliab. 53(9-11): 1427-1429 (2013)
2012
[j1]
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Andreas Rummel, Klaus Schock, Andrew Smith, Stephan Kleindiek:
A new approach for making electrically conductive interconnections between small contacts in failure analysis. Microelectron. Reliab. 52(9-10): 2135-2138 (2012)

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