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Ndy N. Ekere

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Journal Articles

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2016
[j5]
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  dblp key:
  - journals/mr/ZarmaiEOA16
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  - https://dblp.org/rec/journals/mr/ZarmaiEOA16
M. T. Zarmai, Ndy N. Ekere, C. F. Oduoza, Emeka H. Amalu:
Optimization of thermo-mechanical reliability of solder joints in crystalline silicon solar cell assembly. Microelectron. Reliab. 59: 117-125 (2016)
2012
[j4]
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  - journals/mr/OtiabaBEMAAE12
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Kenny C. Otiaba, R. S. Bhatti, Ndy N. Ekere, Sabuj Mallik, M. O. Alam, Emeka H. Amalu, Mathias Ekpu:
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectron. Reliab. 52(7): 1409-1419 (2012)
[j3]
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Emeka H. Amalu, Ndy N. Ekere:
Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations. Microelectron. Reliab. 52(11): 2731-2743 (2012)
[j2]
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  - journals/mr/AmaluE12a
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Emeka H. Amalu, Ndy N. Ekere:
High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height. Microelectron. Reliab. 52(12): 2982-2994 (2012)
2011
[j1]
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  - journals/mr/OtiabaEBMAA11
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Kenny C. Otiaba, Ndy N. Ekere, R. S. Bhatti, Sabuj Mallik, M. O. Alam, Emeka H. Amalu:
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectron. Reliab. 51(12): 2031-2043 (2011)

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