"Numerical study on thermal impacts of different void patterns on ..."

Kenny C. Otiaba et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.01.015

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type: Journal Article

metadata version: 2021-10-14

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Kenny C. Otiaba, R. S. Bhatti, Ndy N. Ekere, Sabuj Mallik, M. O. Alam, Emeka H. Amalu, Mathias Ekpu:
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectron. Reliab. 52(7): 1409-1419 (2012)

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