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ORCIDChao Ren 0008
Person information
- affiliation (PhD 2023): University of Electronic Science and Technology of China, School of Automation Engineering, Chengdu, China
Other persons with the same name
- Chao Ren — disambiguation page
- Chao Ren 0001
![[0000-0002-3088-0008]](https://dblp.uni-trier.de./img/orcid-mark.12x12.png "0000-0002-3088-0008")
— University of Science and Technology Beijing, Beijing Advanced Innovation Center for Materials Genome Engineering, China (and 1 more) - Chao Ren 0002 — Sichuan University, College of Electronics and Information Engineering, Chengdu, China
- Chao Ren 0003 — Tianjin University, School of Electrical and Information Engineering, China (and 1 more)
- Chao Ren 0004 — Chinese University of Hong Kong, School of Architecture
- Chao Ren 0005 — Guilin University of Technology, Guangxi Key Laboratory of Spatial Information and Geomatics, College of Geomatics and Geoinformation, China (and 1 more)
- Chao Ren 0006 — Nanyang Technological University, Interdisciplinary Graduate School, School of Electrical and Electronic Engineering, Singapore
- Chao Ren 0007 — Northeast Forestry University, College of Engineering and Technology, Harbin, China
- Chao Ren 0009 — Lanzhou University, Gansu Provincial Key Laboratory of Wearable Computing, School of Information Science and Engineering, China
- Chao Ren 0010 — Southeast University, School of Economics and Management, Nanjing, China
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2020 – today
- 2024
[j3]Yiping Liang, Libing Bai, Lulu Tian, Xu Zhang, Chao Ren, Dan Shao, Zhenzhong Ma, Mosi Sun:
Enhanced Diffusion-Based Analysis for Fast Defect Detection in ECPT Image. IEEE Trans. Ind. Informatics 20(2): 2884-2896 (2024)- [j2]Xu Zhang, Libing Bai, Yiping Liang, Jinsheng Yang, Jiangshan Ai, Chao Ren:
Surface Defect 3-D Profile Reconstruction Using Eddy Current Pulsed Thermography. IEEE Trans. Ind. Informatics 20(8): 10092-10102 (2024) - 2022
- [j1]Yiping Liang, Libing Bai, Xu Zhang, Chao Ren, Yuhua Cheng:
Potential of Eddy Current Pulsed Thermography as a Nondestructive Testing Method. IEEE Instrum. Meas. Mag. 25(2): 5-15 (2022)
Coauthor Index
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