"Wireless Interconnect in Multilayer Chip-Area-Networks for Future ..."

Oluwole John Famoriji et al. (2017)

> Home

Details and statistics

DOI: 10.1155/2017/6083626

access: open

type: Journal Article

metadata version: 2023-09-30

- view
  - electronic edition via DOI (open access)
  authority control:
- export record
  dblp key:
  - journals/wicomm/FamorijiYKKFAL17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/wicomm/FamorijiYKKFAL17
Oluwole John Famoriji, Xu Yan, Mehdi Khan, Rao Kashif, Akinwale Fadamiro, Md Sadek Ali, Fujiang Lin:
Wireless Interconnect in Multilayer Chip-Area-Networks for Future Multimaterial High-Speed Systems Design. Wirel. Commun. Mob. Comput. 2017 (2017)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.