"Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel ..."

Hao Zhou et al. (2018)

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DOI: 10.1109/TVLSI.2018.2811417

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type: Journal Article

metadata version: 2025-01-19

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Hao Zhou, Hengliang Zhu, Tao Cui, David Z. Pan, Dian Zhou, Xuan Zeng:
Thermal Stress and Reliability Analysis of TSV-Based 3-D ICs With a Novel Adaptive Strategy Finite Element Method. IEEE Trans. Very Large Scale Integr. Syst. 26(7): 1312-1325 (2018)

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