"Integrated Algorithm for 3-D IC Through-Silicon Via Assignment."

Xiaodong Liu et al. (2014)

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DOI: 10.1109/TVLSI.2013.2246876

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type: Journal Article

metadata version: 2022-05-31

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Xiaodong Liu, Gary K. Yeap, Jun Tao, Xuan Zeng:
Integrated Algorithm for 3-D IC Through-Silicon Via Assignment. IEEE Trans. Very Large Scale Integr. Syst. 22(3): 655-666 (2014)

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