"End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ..."

Dawei Li et al. (2017)

> Home

Details and statistics

DOI: 10.1109/TVLSI.2017.2699040

access: closed

type: Journal Article

metadata version: 2020-03-11

- view
  authority control:
- export record
  dblp key:
  - journals/tvlsi/LiJKM17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tvlsi/LiJKM17
Dawei Li, Siddhartha Joshi, Ji-Hoon Kim, Seda Ogrenci Memik:
End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. 25(9): 2498-2511 (2017)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.