"Efficient Approach to Failure Response of Process Module in Dual-Arm ..."

Yan Qiao et al. (2021)

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DOI: 10.1109/TSMC.2019.2899590

access: closed

type: Journal Article

metadata version: 2023-01-30

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Yan Qiao, SiWei Zhang, NaiQi Wu, MengChu Zhou, ZhiWu Li, Ting Qu:
Efficient Approach to Failure Response of Process Module in Dual-Arm Cluster Tools With Wafer Residency Time Constraints. IEEE Trans. Syst. Man Cybern. Syst. 51(3): 1612-1629 (2021)

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