"Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With ..."

Siang Miang Yeo et al. (2024)

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DOI: 10.1109/TR.2023.3294224

access: closed

type: Journal Article

metadata version: 2024-04-27

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Siang Miang Yeo, Ho Kwang Yow, Keat Hoe Yeoh, Siti Nur Farhana Mohamad Azenal:
Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly. IEEE Trans. Reliab. 73(1): 784-791 (2024)

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