"Approach on the Life-Prediction of Solder Joint for Electronic Packaging ..."

Ping Yang et al. (2013)

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DOI: 10.1109/TR.2013.2285038

access: closed

type: Journal Article

metadata version: 2020-07-09

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Ping Yang, Dongjing Liu, Yanfang Zhao, Yunqing Tang, Huan Wang:
Approach on the Life-Prediction of Solder Joint for Electronic Packaging Under Combined Loading. IEEE Trans. Reliab. 62(4): 870-875 (2013)

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