"Void Formation and Their Effect on Reliability of Lead-Free Solder Joints ..."

Paul Wild et al. (2017)

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DOI: 10.1109/TR.2017.2759231

access: closed

type: Journal Article

metadata version: 2020-07-09

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Paul Wild, Tobias Grözinger, Dominik Lorenz, André Zimmermann:
Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates. IEEE Trans. Reliab. 66(4): 1229-1237 (2017)

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