"Electromigration reliability issues in dual-damascene Cu interconnections."

Ennis T. Ogawa et al. (2002)

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DOI: 10.1109/TR.2002.804737

access: closed

type: Journal Article

metadata version: 2020-07-09

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Ennis T. Ogawa, Ki-Don Lee, Volker A. Blaschke, Paul S. Ho:
Electromigration reliability issues in dual-damascene Cu interconnections. IEEE Trans. Reliab. 51(4): 403-419 (2002)

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