"Package-Tolerant MEMS Thermal Wind Sensors Using SIG Technology."

Bo Qi et al. (2025)

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DOI: 10.1109/TIM.2025.3541663

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type: Journal Article

metadata version: 2025-03-07

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Bo Qi, Wenxuan Chen, Zhenxiang Yi, Ming Qin, Qing-An Huang, Lili Gao:
Package-Tolerant MEMS Thermal Wind Sensors Using SIG Technology. IEEE Trans. Instrum. Meas. 74: 1-9 (2025)

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