"In Situ Warpage Measurement of Electronic Packages With Projected Speckle ..."

Yuhan Gao et al. (2024)

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DOI: 10.1109/TIM.2024.3463020

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type: Journal Article

metadata version: 2024-11-06

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Yuhan Gao, Chuanguo Xiong, Weishan Lv, Kezhong Xu, Xin Lei, Fulong Zhu:
In Situ Warpage Measurement of Electronic Packages With Projected Speckle DIC and Deep Learning-Based ROI Identification. IEEE Trans. Instrum. Meas. 73: 1-9 (2024)

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