"Nondestructive analysis of interconnection in two-die BGA using TDR."

Ming-Kun Chen, Cheng-Chi Tai, Yu-Jung Huang (2006)

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DOI: 10.1109/TIM.2006.870318

access: closed

type: Journal Article

metadata version: 2020-06-08

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Ming-Kun Chen, Cheng-Chi Tai, Yu-Jung Huang:
Nondestructive analysis of interconnection in two-die BGA using TDR. IEEE Trans. Instrum. Meas. 55(2): 400-405 (2006)

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