"Thermographic Data Analysis for Defect Detection by Imposing Spatial ..."

Ching-Mei Wen et al. (2021)

> Home

Details and statistics

DOI: 10.1109/TII.2020.3010273

access: closed

type: Journal Article

metadata version: 2021-03-23

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tii/WenSG021
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tii/WenSG021
Ching-Mei Wen, Stefano Sfarra, Gianfranco Gargiulo, Yuan Yao:
Thermographic Data Analysis for Defect Detection by Imposing Spatial Connectivity and Sparsity Constraints in Principal Component Thermography. IEEE Trans. Ind. Informatics 17(6): 3901-3909 (2021)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.