"A Hybrid Deep Learning-Based Framework for Chip Packaging Fault ..."

Jie Wang et al. (2024)

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DOI: 10.1109/TII.2024.3397360

access: closed

type: Journal Article

metadata version: 2024-10-03

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Jie Wang, Gaomin Li, Haoyu Bai, Guixin Yuan, Xuan Li, Bin Lin, Lijun Zhong, Xiaohu Zhang:
A Hybrid Deep Learning-Based Framework for Chip Packaging Fault Diagnostics in X-Ray Images. IEEE Trans. Ind. Informatics 20(9): 11181-11191 (2024)

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