"The Mathematical Model and Novel Final Test System for Wafer-Level Packaging."

Junhui Li et al. (2017)

> Home

Details and statistics

DOI: 10.1109/TII.2016.2643694

access: closed

type: Journal Article

metadata version: 2020-05-21

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tii/LiTLZLZ17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tii/LiTLZLZ17
Junhui Li, Wenya Tian, Hailong Liao, Can Zhou, Xiaohe Liu, Wenhui Zhu:
The Mathematical Model and Novel Final Test System for Wafer-Level Packaging. IEEE Trans. Ind. Informatics 13(4): 1817-1824 (2017)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.